Product Category
PCB Laminates & Prepreg Materials
Laminates, prepregs and specialty base materials for PCB manufacturing, including FR-4, high-Tg, halogen-free, high-speed low-loss, RF/microwave, polyimide and thermal-management materials.
PCB fabrication, RF hardware, new-energy vehicles, industrial control and high-reliability electronics.
Selection Parameters
What to specify for a quote
Category-level selection fields for RFQ preparation. Exact values must be confirmed against the selected model, datasheet and project conditions.
| Parameter | Typical Values / Options | RFQ Input | Engineering Note |
|---|---|---|---|
| Material System | FR-4, High-Tg FR-4, Halogen-free FR-4, Polyimide, PTFE ceramic-filled laminate, Hydrocarbon ceramic laminate, IMS metal-core laminate | Target resin system, IPC slash sheet, dielectric target and thermal class. | Material selection affects dielectric behavior, thermal reliability, process window and cost. |
| Product Form | Copper-clad laminate (CCL), Prepreg, Bondply, Resin-coated copper (RCC), Metal-core laminate | CCL or prepreg type, sheet/roll format, panel size and intended stack-up position. | Separate core, prepreg and bonding material requirements for multilayer builds. |
| Dielectric Constant (Dk) | Low-Dk high-speed grades, RF/microwave Dk classes, Frequency-specific datasheet values | Target Dk, test frequency, test method and controlled-impedance requirement. | Dk varies by frequency, resin system and test method; use data near the operating frequency. |
| Dissipation Factor (Df) | Standard-loss FR-4, Mid-loss, Low-loss, Ultra-low-loss RF/high-speed grades | Maximum Df, operating frequency, insertion-loss target and signal speed. | Df is a primary driver of high-speed and RF transmission loss. |
| Glass Transition Temperature (Tg) | Standard Tg, High Tg, Ultra-high Tg | Required Tg class, soldering profile, number of lead-free reflow cycles and service temperature. | Tg indicates the resin transition region; reliability also depends on Td, CTE and moisture absorption. |
| Decomposition Temperature (Td) | Td at 5% weight loss, Lead-free assembly compatible grades | Minimum Td requirement and expected assembly/rework exposure. | Td is critical for lead-free assembly and thermal survivability. |
| Z-Axis Coefficient of Thermal Expansion (CTE) | Below Tg CTE, Above Tg CTE, Total Z-axis expansion | Via reliability requirement, board thickness, layer count and thermal-cycle profile. | Lower Z-axis expansion helps reduce plated-through-hole fatigue in high-reliability boards. |
| Copper Foil Type and Weight | ED copper, Rolled copper, RTF/VLP/HVLP copper, 0.5 oz, 1 oz, 2 oz | Copper type, copper weight, roughness requirement and finished copper thickness. | Low-profile copper reduces conductor loss in high-speed and RF designs. |
| Laminate / Core Thickness | 0.05-3.2 mm class, Custom core thickness, Prepreg ply combinations | Core thickness, tolerance, panel size and stack-up drawing if available. | Thickness tolerance affects impedance, mechanical stiffness and lamination yield. |
| Thermal Conductivity | Standard FR-4, Thermally conductive dielectric, Metal-core IMS classes | Required W/mK class, heat-source power density and thermal path. | Use thermal materials when heat spreading or LED/power-device temperature rise is a design limit. |
| Flammability Rating | UL 94 V-0, Halogen-free options, Application-specific fire safety requirements | Required flame rating, halogen-free requirement and target market. | Confirm exact certification status by material grade before public model claims. |
| Compliance and Certifications | RoHS, REACH, UL file information, IPC material data, Halogen-free declaration | Required compliance documents, destination market and customer audit requirements. | Compliance documents must match the exact grade, copper type and supplier lot where applicable. |
Gallery
Reference visuals for this category
Applications
Where PCB Laminates and Prepreg Materials are used
Application
Intelligent Communications
Electronic materials, professional radio terminals, industrial communication modules, satellite links and network-optimization capabilities for reliable connectivity in demanding field environments.
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Application
Smart Manufacturing
Materials, communication devices and energy subsystems for Industry 4.0, in-vehicle electronics, industrial control, robotics and intelligent terminals.
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Freight, payment and document notes
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